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(USGovernment-News.Com, February 15, 2016 ) The high-performance thermal interface materials in the form of nano diamonds and increasing use of carbon nanotubes as heat sinks are some of the factors, providing ample growth opportunities for the thermal interface materials market. One of the major factors restraining the growth of the market is its physical properties that limit thermal interface material’s performance.
Asia-Pacific leads the global thermal interface materials market. The Asia-Pacific market is also expected to grow with the highest rate in coming years, where India, Japan, and China are offering considerable growth opportunities. This is due to the growth in end-use industries of the countries such as telecom, electrical and electronics, medical, and automotive.
To minimize the interface thermal resistance between heat sources and heat sinks, the small imperfections and voids are filled with the thermal interface materials. The thermal interface materials are used to connect two components and remove air gaps from the interface, by producing a thermally conductive bond for transferring heat from crucial operating components of the device. In electric vehicles which have large energy storage systems, heat management is necessary. As vehicles are incorporated with more electronics and electrical components, thermal management is becoming progressively important.
Due to the micro-scale surface unevenness, the contact area among heat sinks and high power heat generating components is less than 4%. To enhance heat conduction through the interface and reduction in thermal interfacial resistance, the thermal interface materials are used. Also, for enhancing the device efficacy, proper selection of thermal interface materials is an essential step. Investing in the interface material is more effective than applying various cooling techniques, so as to create a suitable thermal contact.
Some of the competitors in the thermal interface materials market are Parker Hannifin Corporation, Laird Technologies Inc., Wakefield-Vette Inc., Dow Corning Corporation, Honeywell International Inc., Momentive Performance Materials Inc., Zalman Tech Co. Ltd., Henkel AG & Co. KGAA, Indium Corporation, and 3M Company.
Global Thermal Interface Materials Market Segmentation By Type Metal-Based Tapes and Films Phase Change Materials Greases and Adhesives Gap Fillers Thermal Compounds Compressible Interface Materials Elastomeric Pads By Application Medical Devices Automotive Electronics Computers Industrial Machinery Telecom Consumer Durables By Geography North America Europe Asia -Pacific ROW
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